"If you work with those guys you are lucky - they were incredible, and I will probably seek them out when I am ready to upgrade."
Thanks, Michael

Who we are

EWT is a leading manufacturer of industrial laser cutting and marking systems for rolled and flat goods. An innovator in the development of laser cutters.

What we do

EWT provides state-of-the-art laser solutions to customers cutting and marking problems. We base our systems on standard subsystems driven by our unique positioning & control software. We can help you laser cut and mark rolled goods, including but not limited to: textile, woven, non-woven, fabric, plastic film, gasket material, filter material and rigid material that is non-metal.

Our process

Discovery - EWT  works closely with the customer to gain an understanding of their specific cutting or marking problem.
Feasibility - A laser solution to the customers problem will be developed including the test cutting or marking of sample material.
Proposal - A detailed quotation to build and install a laser system that best solves the customer problem will be delivered.

You Win

By using standard subsystems and platforms, we deliver a cost-effective solution. The unique EWT positioning and control system provides a state-of-the-art laser cutter / marker tailored to the customers needs with the ability to upgrade as business needs and technology change. EWT continues to work with the customer to take advantage of changes in technology.

By using our patented technology to cut, kiss-cut or mark the material, move the finished piece out and at the same time move the next piece into the processing area, we have achieved cycle speeds thought to be impossible a few years ago. Most of our systems are a class 1, consistent with EWT motto of "total safety". Our systems are some of the faster designs available and customers have success using them to produce a uniform kiss-cut as well as marking. Any EWT system can be purchased as a stand-alone unit, or incorporated into your line.

The usefulness of the laser for such cutting operations comes from the fact that the beam is highly collimated and can be further focused to a microscopic dot of extremely high power density for cutting.